JNS is trusted by MEMS (Microelectromechanical) developers to provide high-performance MEMS glass wafers for both prototypes and production. JNS capabilities include wafer edge grinding, wafer grinding and polishing, thin film coatings, and slicing and dicing.
MEMS — in its most general form — can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of micro-fabrication. The critical physical dimensions of MEMS devices can vary from well below one micron on the lower end of the dimensional spectrum, all the way to several millimeters.
JNS supports the MEMS community with glass wafers in both standard (200mm) and non standard sizes as large as 685mm diameter. JNS wafers offer the highest level of quality and precision for the most demanding MEMS applications. We welcome your challenges and will work hard to meet your most critical specifications.
Glass is often considered a more desirable material for particular MEMS device applications. There are numerous reasons glass is superior. 1) Higher mechanical, thermal, and chemical resistance. 2) Low dielectric constant of glass and the ability to use highly conductive fabrication techniques. 3) The optical transparency of the glass wafer. These are just some of the reasons that makes glass a reliable, long term solution for many MEMS devices.